BGA (Ball Grid Array) reflow is a specialized technique used to repair and rework BGA components on circuit boards. This process involves heating the board and reflowing the solder balls under the BGA chips to re-establish electrical connections. BGA reflow is critical for addressing issues like poor solder joints or damaged components that can’t be replaced by traditional soldering methods.

As electronics become more complex, BGA components are increasingly used, making this repair technique essential for many modern devices.